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Comprehensive Processing Capabilities

Photolithography

• Single side alignment
• Double side alignment
• Stepper

  Coat/develop

• Spin coat
• Spin develop

 Furnace operations

• Dry and wet oxidation
• Surface doping
• Metal annealing
• Low pressure CVD films

 Metalization

• Sputtering
• E-beam
• Lift-off

 Wet etch

• Anisotropic KOH
• Electrochemical etch stop
• BOE/HF
• Metal etch
• RCA1 and RCA2 clean
• Piranha clean
• Solvent clean
• Sacrificial layer release (CO₂ super-critical drying)
• Pyrex etching

 Reactive ion etching

• Oxide
• Nitride
• Silicon (including Deep RIE)

 Wafer-to-wafer bonding

• Glass frit bonding(Glass frit screen printing/glazing)
• Anodic bonding
• Fusion bonding (Si direct)
• Precision dicing

 Inspection

• SEM
• EDX
• XY measurement
• Z measurement
• Particle
• Ellipsometer
• FTIR spectrometry
• Wyco interferometer

Download a brochure of MEMSplus! Services
capabilities [.pdf requires Adobe Acrobat Reader]

   Terms and Conditions