6-Inch Cleanroom

• Complete dep/photo/etch capabilities
• Wafer inspection/bonding/ dicing/test
• 4,000 SF Class 10 Cleanroom
• 8,000 SF Support Area
• Built and Certified to SMIS2 Safety Standards

4-Inch Cleanroom

• Complete dep/photo/etch capabilities
• Wafer inspection/bonding/ dicing/test
• 3,000 SF Class 100 Cleanroom
• 34,000 SF Support Area

Certified to ISO9001
Certified to AS9100
PROMIS MES and SPC

Photolithography

• Single side alignment
• Double side alignment
• 1X Stepper

Etching through the use of light. Typically, a photosensitive surface (a photoresist) is selectively exposed to light using a template. The exposed areas are subsequently chemically etched.

Coat / Develop

• Spin coat
• Spin develop

One of the steps in the photolithography process, during which chemicals are applied on coated and aligned wafers to remove areas of exposed photo resist, leaving the wafer with a photo resist pattern.

MEMSplus! Specialty: Volume production process control for patterning in cavities of etched devices.

Furnace Operations

• Anisotropic KOH (Glass frit screen printing/glazing)
• Dry and wet oxidation
• Surface doping
• Metal annealing
• Low pressure CVD films
• TEOS

Wet Etch

• Anisotropic KOH
• Electrochemical etch stop
• BOE/HF
• Metal etch
• RCA1 and RCA2 clean
• Piranha clean
• Solvent clean
• Sacrificial layer release (CO2 superficial dryer)

MEMSplus! Specialty
Precise wet silicon etching may be used instead of more expensive DRIE etching. Wet etch specialties include multi-stage etches, front and back side processing and combinations of wet and dry etching. We can hold wet etch lateral dimensions better than 5% and vertical dimensions better than 2%.

Reactive Ion Etching& Thin Film

• Oxide
• Nitride
• Silicon (including Deep RIE)
• Photoresist

MEMSplus! Specialty
Precise across wafer and wafer-to-wafer uniformity in vertical sidewall profiles for through the wafer etching of complex and delicate features.

Wafer-to-Wafer Bonding

• Glass frit bonding (Glass frit screen printing/glazing)
• Anodic bonding
• Eutectic bonding
• Fusion bonding (Si direct)

MEMSplus! Specialty
By applying special processes and tooling, we achieve high alignment accuracy for multiple wafer bonding. Our production includes up to 4 wafer stack bonding of complex and delicate structures, yielding an alignment accuracy of better than 5 microns.

Inspection

• SEM
• EDX
• XY measurement
• Z measurement
• Particle
• Ellipsometer
• FTIR spectrometry
• Wyco interferometer

   Terms and Conditions