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MEMSPlus!SPECIALTY |
BENEFIT |
DESCRIPTION |
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Deep reactive ion etch (DRIE) through wafer manufacturing process |
- Improved yields
- Lower per unit cost
- High quality complex features
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Precise across wafer and wafer-to-wafer uniformity in vertical sidewall profiles for through the wafer etching of complex and delicate features. |
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Precision wet silicon etching |
- Lower per unit cost
- High quality complex features
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Precise wet silicon etching may be used instead of more expensive DRIE etching. Wet etch specialties include multi-stage etches, front and back side processing and combinations of wet and dry etching. We can hold wet etch lateral dimensions better than 5% and vertical dimensions better than 2%. |
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Patterning delicate and complex structures |
- High quality complex features
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Volume production process control for patterning in cavities of etched devices. |
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Multiple wafer bonding |
- Improved device yield
- Lower per device cost
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By applying special processes and tooling, we achieve high alignment accuracy for multiple wafer bonding. Our production includes single wafer triple stack bonding of complex and delicate structures, yielding an alignment accuracy of better than 5 microns. |
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Front and back side processing |
- Volume production of complex devices
- High quality complex devices
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Excellent manufacturing control for precise front to back side registration and processing through multiple etch and deposition stages. |
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 Download a brochure of
MEMSplus! Services capabilities
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